SIM Card 3D Reconstruction Analysis Outsourcing Service
Start of contract for SIM-like 3D reconstruction analysis! *Recommended for material development and troubleshooting in semiconductors and substrates!
We have started offering contracted 3D reconstruction analysis of SIM images using FIB processing observation equipment! We can be of assistance in various fields such as material development, semiconductors, and troubleshooting of substrates! 【High-precision and high-resolution observation of semiconductor device failure analysis and work cross-sections/layer structures】 The focused ion beam (FIB) processing equipment can perform slicing with small, evenly spaced pitches and has the capability to capture images at each step. By utilizing this function, we can achieve high-precision exposure of work cross-sections and high-resolution image acquisition, allowing for the observation of cross-sectional shapes and layer structures of small workpieces. For example, it enables failure analysis of semiconductor devices, observation of wire bond cross-sectional shapes, and verification of plating layer structures and thicknesses. 【Features】 ■ Sequential processing and observation to create reconstruction data ■ High-precision overlay of slice data to create high-quality 3D data ■ Slice pitch can be set from 1nm to 1μm ■ High-resolution observation of SIM images ■ Observation targets: capable of handling up to 200µm ■ Capable of observing even very small targets that may be obscured by polishing processes *For details such as analysis examples, please contact us or download and view the catalog.
- Company：東レ・プレシジョン
- Price：Other
